| 摘要 |
An EMI shield, or module cage, mounts to a circuit board such that a first portion of the module cage extends above a first planar surface of the circuit board and a second portion of the module cage extends below a second planar surface of the circuit board. The module cage surrounds a corresponding transceiver module and allows airflow to travel across the transceiver module and through the module cage in a direction substantially perpendicular to a planar surface of the circuit board to cool the transceiver module. In one arrangement, multiple module cages attach to the circuit board in a modular configuration. Such a configuration allows attachment, to the circuit board, of the number of module cages corresponding to the number of transceiver modules required or utilized by the circuit board.
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