Semiconductor die package processable at the wafer level

摘要

A method for forming a semiconductor die package is provided. The method comprises: forming a semiconductor die including a source contact region and a gate contact region at a first side and a drain contact region at a second side; forming a first conductive path on the semiconductor die extending from the source contact region at the first side to the second side; forming a second conductive path on the semiconductor die extending from the gate contact region at the first side to the second side; and attaching the semiconductor die to a circuit substrate so that the second side is proximate to the circuit substrate and the first side is distal to circuit substrate.