METHOD FOR PRODUCING CERAMIC SUBSTRATE, AND CERAMIC SUBSTRATE

摘要

A method for manufacturing ceramic substrates, and the ceramic substrates are provided to minimize firing strains on a surface conductor by preventing external pollutants from adhering to the surface conductor. A surface-mount-type laminated ceramic capacitor(40) is a laminate of ceramic dielectric layers(5) and wiring pattern layers(6), which are alternately arranged in layers. Each of the wiring pattern layers(6) includes the first capacitor electrode(6a) and the second capacitor electrode(6b), which face each other with the corresponding ceramic dielectric layer(5) sandwiched therebetween. The first via electrodes(8) are electrically connected to the first capacitor electrodes(6a) and are not electrically connected to the second capacitor electrodes(6b). The second via electrodes(8') are electrically connected to the second capacitor electrodes(6b) and are not electrically connected to the first capacitor electrodes(6a). Metal terminals(33) have a diameter greater than that of the via electrodes and include a surface conductor(32) and a plating layer(31). The surface conductors(32) are embedded in a ceramic dielectric layer(7b) whose surface serves as a main surface(CP) of the capacitor(40). A ceramic green sheet(21) to be used in forming the second base portion is prepared. Then, a plurality of ceramic green sheets(5) to be laminated thereon are prepared. A plurality of via holes(4) are formed in the ceramic green sheets(5) at identical positions. A via electrode paste fills the via holes(4) to form via electrodes(8).