发明名称 Photosensitive resin composition, resist composition, fabricating method for patterned substrate, and device
摘要 There are provided a photosensitive resin composition containing at least a polymer compound having a sugar structure, which has at least two species of functional groups cleavable in the presence of an acid, and a photo acid generator generating an acid by radiation of an electromagnetic wave or a beam of an electrically charged particle, and in addition, a resist composition, a method for fabricating a patterned substrate for fabricating a semiconductor device and the like, and a device such as a highly integrated semiconductor and the like.
申请公布号 US6866973(B2) 申请公布日期 2005.03.15
申请号 US20010998228 申请日期 2001.12.03
申请人 CANON KABUSHIKI KAISHA 发明人 MAEHARA HIROSHI
分类号 C08K5/00;C08L1/28;C08L101/02;G03F7/004;G03F7/039;H01L21/027;(IPC1-7):G03F7/039;G03F7/30 主分类号 C08K5/00
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