Fabricating Method of Copper Film for Semiconductor Interconnection,申请号KR20020029543-传众专利搜索

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发明名称	Fabricating Method of Copper Film for Semiconductor Interconnection
摘要
申请公布号	KR100475403(B1)	申请公布日期	2005.03.15
申请号	KR20020029543	申请日期	2002.05.28
申请人		发明人
分类号	C23C18/54;(IPC1-7):C23C18/54	主分类号	C23C18/54
代理机构		代理人
主权项
地址

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