发明名称 HEAT PROCESSING DEVICE
摘要 A heat resistance device is provided to manage effectively temperature by dividing a heat treatment part into two or more regions and installing heaters and sensors at the divided regions. A heating unit is used for heating a bottom surface of a target substrate(W). An exhaust part is used for exhausting the heated gases into a top surface of the target substrate. A temperature detection unit detects a temperature of the target substrate. A chilling unit is used for chilling the gases on the basis of the detected temperature. The heating unit includes a cover body for collecting the heated gases. The exhaust part is formed with an exhaust system connected to an exhaust hole at a center of the cover body. The chilling unit is formed with a chiller and a control unit.
申请公布号 KR20050026447(A) 申请公布日期 2005.03.15
申请号 KR20050012447 申请日期 2005.02.15
申请人 TOKYO ELECTRON LIMITED 发明人 SATA NOBUYAKI;SHIRAGAWA EIICHI
分类号 H01L21/324;H01L21/00;(IPC1-7):H01L21/324 主分类号 H01L21/324
代理机构 代理人
主权项
地址
您可能感兴趣的专利