| 发明名称 |
HIGHLY HEAT-RESISTANT, NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION |
| 摘要 |
A negative-type photosensitive resin composition containing (A) a photo-polimerizable polyamide having an unsaturated double bond (B) a photo-polimerizable monomer having an unsaturated double bond, (C) a photopolymerization initiator and (D) a melamine resin.
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| 申请公布号 |
KR20050025340(A) |
申请公布日期 |
2005.03.14 |
| 申请号 |
KR20057000474 |
申请日期 |
2005.01.10 |
| 申请人 |
ASAHI KASEI EMD CORPORATION |
发明人 |
KANATANI, RYUICHIRO;KIMURA, MASASHI;MARUYAMA, KIMIYUKI |
| 分类号 |
G03F7/035;G03F7/038;(IPC1-7):G03F7/038 |
主分类号 |
G03F7/035 |
| 代理机构 |
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