发明名称 |
ELECTROCHEMICAL PROCESSING CELL |
摘要 |
Embodiments of the invention may generally provide a small volume electrochemical plating cell. The plating cell generally includes a fluid basin configured to contain a plating solution therein, the fluid basin having a substantially horizontal weir. The cell further includes an anode positioned in a lower portion of the fluid basin, the anode having a plurality of parallel channels formed therethrough, and a base member configured to receive the anode, the base member having a plurality of groves formed into an anode receiving surface, each of the plurality of grooves terminating into an annular drain channel. A membrane support assembly configured to position a membrane immediately above the anode in a substantially planar orientation with respect to the anode surface is provided, the membrane support assembly having a plurality of channels and bores formed therein. |
申请公布号 |
KR20050025990(A) |
申请公布日期 |
2005.03.14 |
申请号 |
KR20057001277 |
申请日期 |
2005.01.24 |
申请人 |
APPLIED MATERIALS INC |
发明人 |
DORDI, YEZDI, N.;KOVARSKY, NICOLAY;LUBOMIRSKY, DMITRY;SINGH, SARAVJEET;TULSHIBAGWALE, SHESHRAJ;YANG, MICHAEL, X. |
分类号 |
A23D7/00;A23D7/005;A23D7/01;A23J7/00;C07F9/10;C25D7/12;H01L21/288;(IPC1-7):C25D17/00 |
主分类号 |
A23D7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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