发明名称 METHOD OF FORMING MIM CAPACITOR WITHOUT LEAKAGE CURRENT BETWEEN UPPER AND LOWER ELECTRODES
摘要 PURPOSE: A method of forming an MIM(Metal Insulator Metal) capacitor is provided to prevent leakage current between an upper and lower electrode layer by performing sequentially dry etching on a second metal film and an insulating layer. CONSTITUTION: A first metal film(21) with a trench is formed on a semiconductor substrate. An insulating layer(27) and a second metal film(29) are sequentially deposited thereon. An upper electrode, dielectric film and a lower electrode are formed by etching selectively the second metal film, the insulating layer and the first metal film, respectively. At this time, the dielectric film is formed by performing drying etching using activated plasma.
申请公布号 KR20050024837(A) 申请公布日期 2005.03.11
申请号 KR20030061997 申请日期 2003.09.05
申请人 MAGNACHIP SEMICONDUCTOR, LTD. 发明人 HAN, SEUNG HEE
分类号 H01L27/108;(IPC1-7):H01L27/108 主分类号 H01L27/108
代理机构 代理人
主权项
地址