THERMOSETTING RESIN COMPOSITION FOR HIGH SPEED TRANSMISSION CIRCUIT BOARD, WHICH COMPRISES CYANATE ESTER-BASED RESIN, DICYCLO PENTADIENE-BASED EPOXY RESIN, POLYPHENYLENE ETHER, CYANATE ESTER RESIN AND EPOXY RESIN CURING ACCELERATORS, MONOVALENT PHENOL COMPOUND AND FLAME RETARDANT

摘要

PURPOSE: Provided is a thermosetting resin composition for a high speed transmission circuit board, having a glass transition temperature(Tg) of 180deg.C more and excellent dielectric properties and capable of improving thermal resistance after absorbing moisture, adhesiveness to a foil, moldability, insulating reliability and electrical properties. CONSTITUTION: The thermosetting resin composition comprises (a) 100 parts by weight of a cyanate ester-based resin having at least two cyanate groups in one molecule; (b) 50 to 300 parts by weight of a dicyclopentadiene-based epoxy resin; (c) 5 to 100 parts by weight of a polyphenylene ether having an epoxy functional group; (d) 5 to 300 ppm of a cyanate ester resin curing accelerator; (e) 0.05 to 3 parts by weight of an epoxy resin curing accelerator, based on 100 parts by weight of the dicyclopentadiene-based epoxy resin; (f) 1 to 30 parts by weight of a monovalent phenol compound; and (g) 5 to 50 parts by weight of a flame retardant, based on 100 parts by weight of the cyanate ester-based resin and the dicyclopentadiene-based epoxy resin.