发明名称 Improvements in or relating to the Manufacture of Semiconductor Devices
摘要 1,171,468. Laminates. NATIONAL SEMICONDUCTOR CORP. 8 July, 1966 [8 July, 1965], No. 14489/69. Divided out of 1,171,467. Heading B5N. [Also in Division H1] The subject-matter of this Specification divided from Specification 1,171,467, relates to the formation of a structure consisting of spacedapart wires sandwiched between pressuresensitive-adhesive tapes. In the embodiment, gold-plated wires 32 (Fig. 2) are inserted manually or automatically in spaced groups of grooves formed in circumferential ridges flanking a central magnetized track on feed-wheel 94 so that their ends are held against the underlying adhesive surfaces of glass-fibre backed tapes 45, 47 fed from supply reel 102. Further tapes 44, 46 are pressed on by rubber roller 112 to sandwich the ends of the wires.
申请公布号 GB1171468(A) 申请公布日期 1969.11.19
申请号 GB19690014489 申请日期 1966.07.08
申请人 NATIONAL SEMICONDUCTOR CORPORATION 发明人
分类号 H01L21/52;H01L21/00;H05K13/00 主分类号 H01L21/52
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