CMP APPARATUS FOR PREVENTING MOVEMENT OF PARTICLES AND PIECES OF BROKEN WAFER AND PERFORMING NORMALLY WAFER POLISHING PROCESS

摘要

PURPOSE: A CMP apparatus is provided to prevent damage of other wafers due to pieces and particles of a broken wafer in wafer polishing process by blocking the movement of the particles of the broken wafer. CONSTITUTION: A CMP apparatus includes an HCLU(Head Cup Loading Unloading) part(10) as a loading/unloading location of a wafer, a plurality of pads(20), and a plurality of polishing heads(40) located at upper parts of the HCLU part and the pads. A plurality of isolation parts are formed between the HCLU and the pads. The isolation parts are elevated by a driving device. The isolation parts are formed with barrier members of vertical flat plates.