| 摘要 |
PURPOSE: An apparatus and a method for detecting the defect of wafer edge are provided to obtain a more compact structure by arranging a camera adjacent to a flat aligner in the lower end of wafer cassette. CONSTITUTION: An apparatus for detecting the defect of wafer edge includes a flat aligner, a camera, an illumination unit, a focusing unit, an image processing unit, an input and output unit(170) and a main server. The flat aligner(110) contacts the lower end edge surface of each wafer(1) loaded on a cassette. The wafer is rotated by the flat aligner on the basis of a flat zone of the wafer. The camera(120) for a wafer edge surface is installed adjacent to the flat aligner in the opposite side of lower end edge surface of each wafer.
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