| 摘要 |
PROBLEM TO BE SOLVED: To guarantee that no defective wafer will be produced due to the fact that the deterioration of the blade of a robot handling semiconductor wafer may result in generation of defective particles, and that they may be embedded into semiconductor wafer being handled or may fall on the lower part of the semiconductor wafer. SOLUTION: According to an embodiment, a system (100) for handling semiconductor wafer (110) is equipped with a chamber (102), a robot (130) related to the chamber, and the blade (200) of the robot jointed to the robot at a first edge, that is in general, arranged horizontally in the chamber. The blade of the robot includes the first edge to a remote second edge, and this second edge has a planar view contour forming continuously curved surface. COPYRIGHT: (C)2005,JPO&NCIPI
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