| 摘要 |
PROBLEM TO BE SOLVED: To provide a scratch marker in which a semiconductor device is not contaminated by an electrode material which is cut off in a scratch operation, a size of a scratch mark does not change by abrasion considerably even if carrying out a scratch operation repeatedly, and there is a less possibility of giving an excess mechanical stress to the semiconductor device. SOLUTION: The scratch marker 101 is equipped with at least a wire guide body 105 which has a round portion 102 at the end and supports a wire 103 wound at the round portion 102 not to come off. the loop-like wire 103 sliding along the round portion 102, an elevating mechanism of lifting/dropping the wire guide body 105, and a wire driving mechanism 106 sliding the wire 103 along the round portion 102. COPYRIGHT: (C)2005,JPO&NCIPI
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