发明名称 THERMOSOFTENING HEAT-CONDUCTIVE MEMBER
摘要 PROBLEM TO BE SOLVED: To sharply improve the life of heat generating electronic parts and that of electronic apparatus or the like using them by efficiently diffusing heat generated from heat generating electronic parts to radiation parts as to a heat-conductive sheet to be used for a general power supply, electronic apparatus or the like and a heat-conductive member to be used for heat radiation from integrated circuit elements for an LSI, a CPU or the like of the electronic apparatus such as a personal computer, and a digital video disk drive. SOLUTION: The thermosoftening heat-conductive member is formed by molding a composition consisting of the following components (A) to (C) like a sheet. In a 100 mass (A) of thermoplastic silicon resin, aluminium powder (B) of 1-50μm average grain size and zinc oxide powder (C) of 0.1-5μm average grain size, the mass ratio of the component (B) to the component (C) in the total 400-1,200 mass of the component (B) and the component (C) is in a range of component (B)/component (C)=1 to 10. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005064281(A) 申请公布日期 2005.03.10
申请号 JP20030293312 申请日期 2003.08.14
申请人 SHIN ETSU CHEM CO LTD 发明人 AOKI YOSHITAKA;NAKANO AKIO;TEZUKA HIROAKI;YOSHIDA KUNIHIKO;YONEYAMA TSUTOMU
分类号 H01L23/36;C08K3/22;C08L83/04;C08L83/06;C09K5/14;H01L23/373;(IPC1-7):H01L23/36 主分类号 H01L23/36
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