METHOD OF FORMING WIRING PATTERN, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, ELECTROOPTIC DEVICE, AND ELECTRONIC EQUIPMENT

摘要

PROBLEM TO BE SOLVED: To form a wiring pattern by which a concavo-convex shape is hardly formed on the surface of a substrate forming the wiring pattern, and which has a very flat surface shape. SOLUTION: The method of forming the wiring pattern includes a bank forming step of forming banks B composed of sublimated layers in an area other than a light-irradiated area by partially sublimating a sublimated layer by performing first photoirradiation upon a prescribed in-plane area of a first substrate 1, constituted by laminating a photothermal converting layer containing a photothermal converting material which converts light energy into thermal energy and the sublimated layer containing a sublimating material upon another in this order from the substrate 1 side. The method also includes a conductive layer forming step of disposing a conductive layer 7 between formed banks B, and a transferring step of transferring a conductive pattern layer 70 containing the conductive layer 7 and banks B to a substrate 2 to be treated by facing the conductive pattern layer 70 and substrate 2 to each other and performing second photoirradiation upon the faced substrate 2. COPYRIGHT: (C)2005,JPO&NCIPI