| 摘要 |
PROBLEM TO BE SOLVED: To provide a film carrier tape that reduces the full-etching warping or curling of a conductive layer which becomes one of the warping indexes of the conductive layer at the time of patterning the conductive layer by widening the selection width for the chemical structure of a polyimide film, and also to provide a method of manufacturing the tape. SOLUTION: In the method of manufacturing the film carrier tape having at least a polyimide film layer and an adhesive layer, the adhesive layer is provided on the curled external surface of the polyimide film having a radius of curvature of 20-350 mm. COPYRIGHT: (C)2005,JPO&NCIPI
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