| 摘要 |
FIELD: technological processes of metal treating, namely production of printed circuit boards, plating. ^ SUBSTANCE: solution contains, g/l: nitric acid, 252 - 315; iron nitrate, 50 - 100; sodium chloride, 1 - 5; tin ions - up to 150. Invention provides increased rate of etching tin coating up to 15 micrometer/min. ^ EFFECT: increased rate of etching tin coating, enhanced stability and strength of procedures realized with use of solution. ^ 1 ex |
