| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive thermosetting resin composition having sufficient flexibility and folding resistance and excellent properties in workefficiency, adhesiveness, solvent resistance, heat resistance or the like. <P>SOLUTION: The photosensitive thermosetting resin composition contains: (A) a carboxyl modified epoxy (meth)acrylate resin obtained by reacting a bisphenol type epoxy resin and a (meth)acrylic acid and further reacting the product with an acid anhydride; (B) a biphenyl type epoxy resin; (C) a photopolymerization initiator; and (D) a diluent. The acid value of the (A) carboxyl modified epoxy acrylate resin is 125 to 145 mgKOH/g. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
