| 摘要 |
PROBLEM TO BE SOLVED: To facilitate a bonding process for mounting an antenna integrated element on a flat surface of a silicon hemispherical lens, to improve the positioning accuracy of the antenna integrated element, and to avoid an influence of a stress at the time of the mounting. SOLUTION: A submount 4 is disposed on the flat surface of the silicon hemispherical lens 2, and the antenna integrated element 3 is mounted on the submount 4. The submount 4 is made of a silicon plane of the same material as that of the lens 2, its top is superimposed on the flat surface periphery edge of the lens 2, and a mark 9 indicating a mounting position of the element 3 is formed on its top surface. The lens 2 is joined in the mounting hole 1a of a casing 1 with an adhesive 10. COPYRIGHT: (C)2005,JPO&NCIPI |
