| 摘要 |
PROBLEM TO BE SOLVED: To provide method and device for supplying a semiconductor chip capable of nicely and sequentially picking up the semiconductor chip mounted on a UV sheet at a predetermined position with a simple constitution, and, as a result, capable of improving the manufacturing yield and the manufacturing efficiency of the semiconductor manufacturing device. SOLUTION: On the front surface side of the rear surface of the UV sheet 3, a plurality of semiconductor chips 1 are bonded by an adhesive which loses the adhesive power by the irradiation of ultraviolet ray, is put on an ultraviolet ray permeable glass substrate 4, and is irradiated by ultraviolet ray from an ultraviolet ray light source 5 below the glass substrate 4 permeable in ultraviolet ray to lose the adhesive power of the adhesive, then, respective semiconductor chips 1 on the UV sheet 3 are picked up one by one by a collet 6 to supply the semiconductor chips 1 to the semiconductor manufacturing device (not shown). COPYRIGHT: (C)2005,JPO&NCIPI |
