| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component that is excellent in weather resistance and can be reduced in thickness, and to provide a method of manufacturing the component. SOLUTION: A semiconductor device 10 is provided with a structure constituted by successively laminating an insulating layer 3, a conductive layer 4, and a sealing layer 5 on one surface 1a of a semiconductor substrate 1 in this order; and solder bumps 7 formed on electrode pads 6. In the device, tops 7a of the solder bumps 7 have flat surfaces, and a protective layer 8 is provided over the whole surface of the structure on which the solder bumps 8 are formed so that the flat surfaces of the bumps 7 are exposed. Heights d<SB>1</SB>of the solder bumps 7 and the thickness d<SB>2</SB>of the semiconductor substrate 1 are adjusted to be d<SB>1</SB>≥d<SB>2</SB>. The method of manufacturing the electronic component includes a step A of forming the solder bumps 7 on the electrode pads 6, a step B of forming the protective layer 8, and a step C of grinding the surface of the protective layer 8 so that the tops 7a of the solder bumps 7 are exposed and have the flat surfaces. The method also includes a step D of back-grinding the other surface of the semiconductor substrate 1. COPYRIGHT: (C)2005,JPO&NCIPI |
