| 摘要 |
PROBLEM TO BE SOLVED: To provide an inexpensive semiconductor device which is enhanced in heat dispersion characteristics and easily manufactured, and also to provide its manufacturing method. SOLUTION: The semiconductor device is provided with a package substrate 1 having a solder bump 2 connected with the terminal of a semiconductor chip 3, the semiconductor chip 3 connected facedown to the solder bump 2 of the package substrate, a heat spreader 8 having the size including the semiconductor chip 3 in a planar view and located on the semiconductor chip 3, and a heat dispersing adhesion layer 9 which is interposed between the semiconductor chip 3 and the heat spreader 8 and adheres both of them. A support member, which supports the heat spreader 8 to the package substrate 1, is not provided between the heat spreader 8 and the package substrate 1 around the semiconductor chip 3. COPYRIGHT: (C)2005,JPO&NCIPI |
