PHOTODEPOSITION GOLD PLATING METHOD AND GOLD PLATING FORMATION APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a photodeposition gold plating method which can be easily practiced without limitation on the conductivity of a substrate or can simply perform the formation of a gold plating locally or entirely on the surface of the substrate. SOLUTION: The photodeposition gold plating method comprises setting a substrate 2 to be plated in an aqueous solution containing metal ions and a reducing agent and irradiating the substrate 2 with light in the ultraviolet region from a light source 6 to form a gold plating on the surface of the substrate 2 by a photodeposition reaction. COPYRIGHT: (C)2005,JPO&NCIPI