发明名称 |
SEMICONDUCTOR LIGHT EMITTING DEVICE, LIGHT EMITTING MODULE, LIGHTING APPARATUS, DISPLAY ELEMENT AND MANUFACTURING METHOD OF SEMICONDUCTOR LIGHT EMITTING DEVICE |
摘要 |
An LED array chip (2), which is one type of a semiconductor light emitting device, includes an array of LEDs (6), a base substrate (4) supporting the array of the LEDs (6), and a phosphor film (48). The array of LEDs (6) is formed by dividing a multilayer epitaxial structure including a light emitting layer into a plurality of portions. The phosphor film (48) covers an upper surface of the array of the LEDs (6) and a part of every side surface of the array of LEDs (6). Here, the part extends from the upper surface to the light emitting layer. |
申请公布号 |
WO2005022654(A2) |
申请公布日期 |
2005.03.10 |
申请号 |
WO2004JP11713 |
申请日期 |
2004.08.09 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO.,LTD.;NAGAI, HIDEO |
发明人 |
NAGAI, HIDEO |
分类号 |
F21K99/00;H01L27/15;H01L33/10;H01L33/38;H01L33/50 |
主分类号 |
F21K99/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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