发明名称 GLASS CERAMICS WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide glass ceramics composed of SiO<SB>2</SB>-Al<SB>2</SB>O<SB>3</SB>-MgO-CaO based glass and Al<SB>2</SB>O<SB>3</SB>, and glass ceramics wiring board whose adhesion strength with a wiring conductor is high. SOLUTION: The glass ceramics wiring board is constituted by laminating a plurality of insulating layers which contains SiO<SB>2</SB>-Al<SB>2</SB>O<SB>3</SB>-MgO-CaO based glass and Al<SB>2</SB>O<SB>3.</SB>In the glass ceramics wiring board wherein the wiring conductors whose principal component is silver are formed on surfaces of the insulating layers and between the layers, the wiring conductor contains glass containing SrO. As a result, wettability of interface between the wiring conductor and the glass ceramics composed of SiO<SB>2</SB>-Al<SB>2</SB>O<SB>3</SB>-MgO-CaO based glass and Al<SB>2</SB>O<SB>3</SB>is improved, and adhesion strength of the wiring conductor is improved. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005064436(A) 申请公布日期 2005.03.10
申请号 JP20030302202 申请日期 2003.08.26
申请人 KYOCERA CORP 发明人 MAKINO HIROSHI
分类号 H05K1/09;H01L23/15;H05K3/46;(IPC1-7):H01L23/15 主分类号 H05K1/09
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