Wire bonding method, semiconductor chip, and semiconductor package

摘要

A method of wire bonding, a semiconductor chip, and a semiconductor package provides stitch-stitch bonds of a wire on a bond pad of a chip as well as on a bond position of a substrate. A ball-stitch bump is formed on an end of the wire extending from a capillary or provided on the bond pad of the chip. A ball-stitch bump is formed on the bond pad of the chip by pressing down the ball of the wire on the bond pad. A ball-stitch stitch bond of the wire is formed on the ball-stitch bump by pressing down the wire on the ball-stitch bump. The capillary is moved from the bond pad to the bond position, while loosening the wire. A stitch bond of the wire is formed on the bond position by pressing down the wire on the bond position, and then separated from the wire within the capillary. The method of wire bonding, a semiconductor chip, and a semiconductor package can reduce or minimize a moving path of the capillary and provide more effective wire bonding.