| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent solder balls from being wrongly mounted when solder balls are collectively mounted on a plurality of BGAs. <P>SOLUTION: The pad formation surface of a CSP 400 is photographed, a pad arrangement is recognized through image processing, and the CSP 400 is positioned for transferring solder balls based on the recognition results of the pad arrangement, whereby the positions of the pads 401 on the pad formation surface of the CSP 400 can accurately be matched with those of solder ball suction nozzles possessed by a solder ball mounting device independently of how pads 401 are formed and arranged on the pad formation surface of the CSP 400. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
