| 摘要 |
PROBLEM TO BE SOLVED: To fill a through-hole surely with resin independently of the thickness of a board as a material to be filled or the viscosity of resin. SOLUTION: A resin filling device is equipped with a filler resin tank 11, a pair of frames 12 and 13 provided with filling squeegees 14b and 14b which are arranged face to face with each other in the filler resin tank 11, and a first moving unit 15 which transfers the board 21 as a material to a space between the frames 12 and 13 which are arranged face to face with each other. The board 21 as a material to be filled is dipped into a filler resin 19 between the frames 12 and 13 in the filler resin tank 11 by the first moving unit 15, the filling squeegees 14b are brought into close contact with the surface of the dipped board 21, and the board 21 is moved relatively to the filling squeegees 14b by the moving unit 15 to fill the through-hole 21a with the filler resin 19. COPYRIGHT: (C)2005,JPO&NCIPI
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