SEMICONDUCTOR COMPONENT COMPRISING A REWIRING LAYER, AND METHOD FOR THE PRODUCTION THEREOF

摘要

The invention relates to a semiconductor component comprising a plastic housing (41), at least one semiconductor chip (1), and a rewiring layer (8). The rewiring layer (8) is provided with an insulating level (9) and a rewiring level (10). The rewiring level (10) encompasses alternately disposed parallel signal conductors (12) and ground or power supply conductors (13) or exclusively parallel signal conductors (12). In the latter case, a electrically conducting metallic layer that can be connected to ground potential or power supply potential is additionally provided to close the rewiring layer or in the form of a coating.