METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND PRINTED WIRING BOARD

摘要

[PROBLEMS] A printed wiring board having a through hole conductor is disclosed which can be manufactured by both subtractive process and additive process. [MEANS FOR SOLVING PROBLEMS] A printed wiring board (100) comprises a through hole conductor (6) which is formed on the surface of a through hole (5) formed in a copper-clad laminate (1) and on a part of the surface of the copper-clad laminate (1) surrounding the opening of the through hole (5). The through hole conductor (6) is filled with a positive photosensitive resin (7), and a lid conductor (8) is formed on top of the positive photosensitive resin (7) and the through hole conductor (6). A circuit pattern (14) is formed on the surface of the copper-clad laminate (1). An insulating layer (3) is formed over the upper surface of the copper-clad laminate (1), the lid conductor (8) and the circuit pattern (14), and a via hole (16) is so formed in the insulating layer (3) as to range from the surface of the layer (3) to the lid conductor (8). A via conductor (10) is formed in the via hole (16) and on a part of the surface of the insulating layer (3) surrounding the opening of the via hole (16).