| 摘要 |
PURPOSE: A semiconductor device, a semiconductor module, and a fabricating method thereof are provided to perform a bonding process under convenient environment by fixing first and second semiconductor chips to a lead frame after embodying the first and second semiconductor chips. CONSTITUTION: A semiconductor device(120a-120d) includes a circuit board having a first main surface and a second main surface, an electrode(103) installed on the first main surface of the circuit board, a semiconductor chip connected to the second main surface of the circuit board, a sealing member for sealing the circuit board and the semiconductor chip in order to expose the first main surface of the circuit board, and a coupling part(121a-121c,122a-122d) connected to an adjacent semiconductor device. The semiconductor device has a substantially rectangular exterior. |
