PACKAGE BODY FOR ELECTRONIC COMPONENT AND PIEZOELECTRIC DEVICE, METHOD OF MANUFACTURING PIEZOELECTRIC DEVICE, CELLULAR PHONE UTILIZING PIEZOELECTRIC DEVICE, AND ELECTRONIC EQUIPMENT UTILIZING PIEZOELECTRIC DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a package for electronic components constituted so that a lid which seals a package body is hardly damaged while making the size in the horizontal direction as small as possible, a piezoelectric device using it and its manufacturing method, etc.

SOLUTION: The package for electronic components has: a package body 37 having an internal space S1 for storing the electronic components and composed of an insulation material the upper part of which is opened; and a lid 39 for shielding the opening of the package body. The package body is formed approximately in a rectangular shape, at least a pair of mutually facing sides located in the periphery of the opening of the package body have outlines larger than that of the lid, and protection parts 61, 61 projecting in the height direction are formed outside the lid of the pair of facing sides.

COPYRIGHT: (C)2005,JPO&NCIPI