| 摘要 |
PROBLEM TO BE SOLVED: To prevent a semiconductor wafer from being damaged by preventing a protective tape from being twisted when the protective tape is stuck on the surface of the semiconductor wafer, and a protective tape side is held by electrostatic attraction to subject the rear surface of the semiconductor wafer to plasma etching. SOLUTION: DC voltage for electrostatic attraction is supplied to a chuck table, and then minute discharge electric power is supplied (minute discharge electric power supply process), and the value of the DC voltage is raised gradually in this state. Consequently, electrostatic force is gradually raised and rapid electrostatic attraction is prevented (DC voltage raising process). COPYRIGHT: (C)2005,JPO&NCIPI |
