| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device wherein a semiconductor device that is bonded on a semiconductor base substrate by a metallic layer is hard to be separated from the semiconductor base substrate, and a refrigerant is prevented from leaking from the distribution member thereof. SOLUTION: A semiconductor device 40 is bonded on the surface of a semiconductor base substrate 10 by means of an insulating layer 25 and a metallic layer 30 or the like. The insulating layer contains the same elements as the semiconductor base substrate and/or a substrate of the semiconductor device. The semiconductor base substrate is provided with a recessed part on its rear surface wherein a refrigerant is distributed. The insulating layer contains the same elements as the semiconductor base substrate, so that the semiconductor device is hard to be separated from the semiconductor base substrate, and the metallic layer can be prevented from being deteriorated because it contains the same elements as the substrate of the semiconductor device. COPYRIGHT: (C)2005,JPO&NCIPI |
