发明名称 METHOD OF MANUFACTURING WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a method of easily manufacturing a wiring board which is equipped with no core board and formed by laminating dielectric layers of polymeric material and conductor layers alternately. SOLUTION: An underlying dielectric sheet 21 is formed on a support board 20. On the main surface of the sheet 21, a laminated sheet 10 is equipped with: a metal foil close contact body 5 composed of two metal foils 5a and 5b which can be separated from each other by heating and are brought into close contact with each other; and a first dielectric sheet 11 which is formed so as to wrap up the metal foil close contact body 5 and to seal up the metal foil close contact body 5 coming into close contact with the underlying dielectric sheet 21 in the surrounding region 21c of the metal foil close contact body 5. A region above the metal foil close contact body 5 is selected out of the laminated sheet 10 to serve as a wiring laminated unit 100 serving as a wiring board, the peripheral part of the wiring laminated unit 100 is removed to expose the end faces 103 of the wiring laminated unit 100, and then the wiring laminated unit 100 is separated by heating from the support board 20 attaching the metal foil 5b to itself at the interface between the metal foils 5a and 5b of the metal foil close contact body 5. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005063988(A) 申请公布日期 2005.03.10
申请号 JP20030206799 申请日期 2003.08.08
申请人 NGK SPARK PLUG CO LTD 发明人 ITO TATSUYA
分类号 H05K3/46;H01L23/12;(IPC1-7):H05K3/46 主分类号 H05K3/46
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