| 摘要 |
PROBLEM TO BE SOLVED: To obtain an adhesive varnish for screen printing relatively readily carrying out control and preservation, slightly protruding the adhesive screen printed during bonding, following even to a substrate with unevenness, scarcely causing a defective filling part and used for die attach of a semiconductor element, and to provide a lead frame with the adhesive prepared by applying the adhesive varnish by screen printing, a resin substrate, a semiconductor wafer, and a semiconductor device using the same. SOLUTION: The adhesive varnish for the screen printing is composed of (A) 100 pts. wt. of a polyimide resin polymerized from an acid dianhydride component composed of a tetracarboxylic dianhydride and a diamine component containing a siliconediamine of a specific structure and an aromatic diamine of a specific structure as principal components, (B) 5-200 pts. wt. of an epoxy resin, (C) 0.1-100 pts. wt. of an epoxy resin curing agent, (D) 0-300 pts. wt. of an inorganic filler and (E) 100-500 pts. wt. of an organic solvent. COPYRIGHT: (C)2005,JPO&NCIPI
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