发明名称 HIGH SPEED INJECTION MOLDING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a high speed injection molding method capable of performing high speed injection molding without producing a weldline. SOLUTION: A sprue 21, a plurality of runners 22 and the gates 23 arranged to the leading ends of the runners 22 are formed to a fixed mold 2 while gas recovery grooves 31 are formed to a movable mold at four places in the vicinity of the inside of a cavity C. A microgap of a degree not passing a molten resin material but discharging only gas is formed to the parting line between the fixed mold 2 and the movable mold at the time of mold clamping to perform injection molding by light mold clamping. At this time, the molten resin material is metered in an amount almost same to the volume of the cavity C to be charged in the cavity C before injected at an injection speed of 1.5-3 sec with respect to an injection amount of 2-3 kg. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005059252(A) 申请公布日期 2005.03.10
申请号 JP20030285933 申请日期 2003.08.04
申请人 SAKO KATSUTOSHI 发明人 SAKO KATSUTOSHI
分类号 B29C45/34;B29C45/70;(IPC1-7):B29C45/34 主分类号 B29C45/34
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