发明名称 |
Pressurized oxygen for evaluation of molding compound stability in semiconductor packaging |
摘要 |
A test environment and an associated method of testing and analyzing a semiconductor package material containing a molding compound, for stability in a sustained oxygen environment. Test samples are exposed to a pressurized gas containing oxygen, under elevated temperature below the glass transition temperature of the molding compound. Control samples are exposed to a pressurized inert gas under similar or more severe conditions of gas pressure, temperature, and humidity. At least one characteristic common to the test samples and the control samples is measured. A determination is made as to whether there exists at least one significant difference between the at least one measured characteristic of the test samples and the control samples.
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申请公布号 |
US2005054109(A1) |
申请公布日期 |
2005.03.10 |
申请号 |
US20030658859 |
申请日期 |
2003.09.09 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
COMEAU JOSEPH K.V.;MAHONEY ADELE M.;RITTER JASON P.;SEILLA GERALD J.;WILSON CHARLES H. |
分类号 |
G01M99/00;G01N27/20;(IPC1-7):G01N33/00 |
主分类号 |
G01M99/00 |
代理机构 |
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代理人 |
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