| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which makes pattern forming easy and which has characteristics of high heat resistance, high reliability such as high moisture-resistant reliability, further high transparency and a low dielectric constant. <P>SOLUTION: The photosensitive resin composition contains: (A) an alkali-soluble resin obtained by heating and reacting at least one compound expressed by general formulae (1) to (4) with a compound having two or more benzocyclobutene structures in one molecule at 100 to 200°C; (B) a crosslinking material; and (C) a photosensitive material having a 1,2-benzoquinone diazide structure or a 1,2-naphthoquinone diazide structure. In the formulae, each of R<SB>1</SB>and R<SB>3</SB>represents a hydrogen atom or a ≤6C alkyl group, each of R<SB>2</SB>and R<SB>4</SB>represents a ≤6C alkyl group or a single bond, R<SB>5</SB>represents a divalent cyclic compound group having at least one hydroxyl group or more, R<SB>6</SB>represents -CH<SB>2</SB>- or -CO-, m is an integer 0 to 2, n is an integer 1 to 3, p is an integer 0 to 2, and q is an integer 1 to 3. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
