| 摘要 |
PROBLEM TO BE SOLVED: To apply a coating liquid on a material to be coated to have a uniform thickness in a material liquid application header for a thin film forming apparatus, and to provide the thin film forming apparatus. SOLUTION: The material liquid application header 60 for the thin film forming apparatus for applying the material liquid 4 on the material 30 to be coated along the moving direction by supplying the material liquid 4 on a target surface of the relatively moving material 30 to be coated is constituted so as to be provided with a material liquid supply port 61 for supplying the material liquid on the target surface formed to face the movement path of the material 30 to be coated and an excess liquid suction port 62 formed to face the movement path of the material 30 to be coated, adjacent to the downstream side of the material liquid supply port 61 in the movement direction of the material 30 to be coated and for sucking an excess liquid 4a in the material liquid 4 supplied to the target surface. COPYRIGHT: (C)2005,JPO&NCIPI
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