发明名称 Atomic layer deposited ZrAlxOy dielectric layers
摘要 An atomic layer deposited ZrAlxOy dielectric layer and a method of fabricating such a dielectric layer produce a reliable dielectric layer having an equivalent oxide thickness thinner than attainable using SiO2. Pulsing a zirconium-containing precursor onto a substrate, pulsing a first oxygen-containing precursor, pulsing an aluminum-containing precursor, and pulsing a second oxygen-containing precursor to form ZrAlxOy by atomic layer deposition provides a dielectric layer with a relatively high dielectric constant as compared with silicon oxide and with a relatively low leakage current. Dielectric layers containing atomic layer deposited ZrAlxOy are thermodynamically stable such that the ZrAlxOy will have minimal reactions with a silicon substrate or other structures during processing.
申请公布号 US2005054165(A1) 申请公布日期 2005.03.10
申请号 US20030403734 申请日期 2003.03.31
申请人 MICRON TECHNOLOGY, INC. 发明人 AHN KIE Y.;FORBES LEONARD
分类号 C23C16/40;C23C16/44;C23C16/455;H01L21/28;H01L21/314;H01L21/316;H01L21/8239;H01L29/51;(IPC1-7):H01L21/336;H01L21/476;H01L21/320;H01L21/31;H01L21/469 主分类号 C23C16/40
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