发明名称 |
Atomic layer deposited ZrAlxOy dielectric layers |
摘要 |
An atomic layer deposited ZrAlxOy dielectric layer and a method of fabricating such a dielectric layer produce a reliable dielectric layer having an equivalent oxide thickness thinner than attainable using SiO2. Pulsing a zirconium-containing precursor onto a substrate, pulsing a first oxygen-containing precursor, pulsing an aluminum-containing precursor, and pulsing a second oxygen-containing precursor to form ZrAlxOy by atomic layer deposition provides a dielectric layer with a relatively high dielectric constant as compared with silicon oxide and with a relatively low leakage current. Dielectric layers containing atomic layer deposited ZrAlxOy are thermodynamically stable such that the ZrAlxOy will have minimal reactions with a silicon substrate or other structures during processing. |
申请公布号 |
US2005054165(A1) |
申请公布日期 |
2005.03.10 |
申请号 |
US20030403734 |
申请日期 |
2003.03.31 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
AHN KIE Y.;FORBES LEONARD |
分类号 |
C23C16/40;C23C16/44;C23C16/455;H01L21/28;H01L21/314;H01L21/316;H01L21/8239;H01L29/51;(IPC1-7):H01L21/336;H01L21/476;H01L21/320;H01L21/31;H01L21/469 |
主分类号 |
C23C16/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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