| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent a wire for electrically connecting a semiconductor chip and an internal lead from being cut by heat generated when a semiconductor device is mounted on a printed circuit board. <P>SOLUTION: In a resin package-type semiconductor device provided with the semiconductor chip, a die pad on which the semiconductor chip is loaded, at least one piece of the wire 12 whose one end is contact bonded to the semiconductor chip, the internal lead 13 which is electrically connected to the semiconductor chip by contact bonding the other end of the wire 12 and a resin package for enclosing the semiconductor chip and the internal lead 13, the wire 12 has a part thereof which is laid on the surface of the internal lead by a certain distance from the reference end of the pressure-bonded part 12b with the internal lead 13 and a bent part 12d located at the end of the section in the vicinity of the reference end of the pressure-bonded part 12b with the internal lead 13. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
