| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which makes pattern forming easy and which has characteristics of high heat resistance, high reliability such as moisture-resistant reliability, high transparency and a low dielectric constant. <P>SOLUTION: The photosensitive resin composition contains: (A) a resin which is obtained by heating and reacting at least one compound expressed by general formulae (1) to (4) and a compound having two or more benzocyclobutene structures in one molecule at 100 to 200°C and has ≤400 g/mol hydroxyl equivalent and in which groups selected from 2-20C alkoxycarbonyl groups, 2-20C alkoxyalkyl groups, 1-10C alkyl-substituted silyl groups, tetrahydropyranyl groups and tetrahydrofuranyl groups are substituted for 5 to 80% of hydrogen atoms in the entire hydroxyl groups included in the resin; and (B) a compound which generates an acid by light. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
