STACKED MEMORY MODULE AND MEMORY SYSTEM

摘要

PROBLEM TO BE SOLVED: To provide a stacked memory module with which a large-capacity memory module is operated at high speed, and to provide a memory system.

SOLUTION: The stacked memory module includes: first and second circuit boards; an electric connector; and a buffer. The first and second circuit boards have inner faces facing each other and outer faces facing away from each other. The first circuit board includes a connection portion for connecting the memory module to a mother board. At least one of the inner and outer faces of the first circuit board loads a first plurality of memory chips. At least one of the inner and outer faces of the second circuit board loads a second plurality of memory chips. The electrical connector electrically connects the first and second circuit boards. The buffer is loaded on the first circuit board and buffers signals for the first and second plurality of memory chips.

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