| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of an electronic device which has less restriction in the design of an IC chip and a package, improves productivity, and has easy generalization, in the case of manufacturing the highly functional electronic device by integrating to a high-density. <P>SOLUTION: The manufacturing method of the electronic device includes a process for forming an adhesive layer 5 on a slave chip 3, and a process for mounting the slave chip 3 on a master chip 2, so that most of the whole surface of the electrode formation surface of a second electronic device, i.e. the slave chip 3, having an electrode connected to the Au stud bump 1 of the master chip 2, is covered, while the second electronic device, i.e. the slave chip 3 is mounted on a first electronic device, i.e. the master chip 2 having a metallic bump electrode, i.e. an Au stud bump 1. The interval between the master chip 2 and the slave chip 3 is sealed by the adhesive layer 5 while the Au stud bump 1 of the master chip 2 penetrates the adhesive layer 5 in the process for mounting the slave chip 3 on the master chip 2, to connect to electrodes on the slave chip 3. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
