MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a process of sealing with a resin capable of preventing voids from being produced in a sealing resin. SOLUTION: This method includes: a process of preparing a semiconductor wafer 11 having a first main surface 11a and a second main surface 11b; a process of preparing a first and second metallic molds 100 and 200; a process of holding the semiconductor wafer with the first metallic mold in such a manner that the first main surface is exposed; a process of arranging a film-like member 40 on the second metallic mold; a process of supplying a predetermined amount of resin 50 to a predetermined region on the resin arranging region 40a of the film-like member; a process of heating the first and second metallic molds; a process of forming a cavity 60 by bringing the first metallic mold and the second metallic mold into contact with each other through the film-like member and arranging the first main surface and the resin in the cavity; and a process of forming a sealing part on the first main surface by bringing the melted resin that is the resin melted into contact with the first main surface through decompressing the inside of the cavity and reducing the capacity of the cavity. COPYRIGHT: (C)2005,JPO&NCIPI