TAPE CARRIER FOR FABRICATING EFFICIENTLY SEMICONDUCTOR DEVICE BY REDUCING MOUNTING AREA OF SEMICONDUCTOR DEVICE

摘要

PURPOSE: A tape carrier is provided to miniaturize an electronic device by reducing a mounting area to a loading area of a bare chip and securing the mounting area within the same area. CONSTITUTION: A tape carrier(10) includes a bonding part(14) of a matrix type. The bonding part is formed on a substrate(12). The tape carrier further includes a recognition mark(22) to divide regularly the bonding part in plural columns and in plural rows. A joint is formed by connecting divided parts to each other. A joint mark is formed at the divided part having the joint. The joint mark is formed by punching the recognition mark. The tape carrier includes at least two kinds of recognition marks having difference shapes. The recognition marks are detected by an inspection apparatus.