| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a printed wiring board equipped with passive element with the less number of processes than that in a conventional manner. <P>SOLUTION: A high dielectric constant resin layer(second insulating layer) 9, metal layers(second conductor layers) 11 and 12 where a window hole for laser 10 is formed, an insulating resin layer(first insulating layer) 14 and a surface metal layer(first conductor layer) are integrally laminated in this order at the surface side of a flattened internal layer circuit board G with a circuit pattern(third conductor layer) on the surface. Afterwards, a laser beam is irradiated from the upper part of the first conductor layer to a part corresponding to the window hole for laser 10, and a laser hole reaching the third conductor layer is formed, and a metal layer is formed on the internal wall of the laser hole and the overall surface of the third conductor layer, and an external layer circuit pattern is formed around the hole of the substrate surface and in a necessary place. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
